The HWComponents (Hardware Components) package, part of the CiMLoop project, provides an interface for the estimation of energy, area, and leakage power of hardware components in hardware architectures. Key features in HWComponents include:
Information about the package is available on the hwcomponents website.
If you use this package in your work, please cite the CiMLoop project:
@INPROCEEDINGS{10590023,
author={Andrulis, Tanner and Emer, Joel S. and Sze, Vivienne},
booktitle={2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)},
title={CiMLoop: A Flexible, Accurate, and Fast Compute-In-Memory Modeling Tool},
year={2024},
volume={},
number={},
pages={10-23},
keywords={Performance evaluation;Accuracy;Computational modeling;Computer architecture;Artificial neural networks;In-memory computing;Data models;Compute-In-Memory;Processing-In-Memory;Analog;Deep Neural Networks;Systems;Hardware;Modeling;Open-Source},
doi={10.1109/ISPASS61541.2024.00012}
}
@INPROCEEDINGS{8942149,
author={Wu, Yannan Nellie and Emer, Joel S. and Sze, Vivienne},
booktitle={2019 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)},
title={Accelergy: An Architecture-Level Energy Estimation Methodology for Accelerator Designs},
year={2019},
volume={},
number={},
pages={1-8},
keywords={Program processors;Electric breakdown;Neural networks;Estimation;Hardware;Energy efficiency;Compounds},
doi={10.1109/ICCAD45719.2019.8942149}
}